Samsung is reportedly developing a new cooling solution for future Exynos smartphone processors.
What is known
This packaging technology, inspired by PCs and servers, involves the use of a heatsink attached to the top of the processor. Development is expected to be completed by Q4 2024. This makes it a potential complement to the Exynos 2500, which is likely to be used in some Galaxy S25 models.
The Exynos 2400 performed slightly worse in the heat test than the Snapdragon 8 Gen 3. The Exynos 2200 2022 had even more severe overheating problems.
The new FOWLP-HPB (Fan-out wafer-level package-HPB) packaging technology aims to solve these problems with a heatsink called HPB (Heat Path Block). It's used in PCs and servers and hasn't been used in smartphones before because of their smaller form factor.
Samsung hopes FOWLP-HPB will improve cooling, stabilize performance, increase battery life and generally lead to cooler phones.
If the technology is finalized in time, the Exynos 2500 could be the first smartphone chipset to receive this innovation. This will be a significant step forward for Samsung as it seeks to compete with Qualcomm in the field of mobile processors.