A faster, more efficient method of manufacturing chips has been developed that could change the industry

Researchers at North Carolina State University have introduced a revolutionary method for manufacturing microcircuits with nanometer-sized elements. This innovative method simplifies the production of microcircuits while significantly reducing the percentage of defects, which marks a potential shift in semiconductor manufacturing processes.

The new process involves using molds filled with liquid metal instead of traditional methods involving the use of masks, etching and multi-step processing, reports 24 Kanal with reference to New Atlas.

How the new technology works

The scientists used a low-melting alloy known as Field metal, which consists of indium, bismuth and tin. This liquid metal is oxidized to form a surface oxide layer, which is then treated with a solution containing ligands – molecules that bind to metal ions.

The liquid with the ligands penetrates the mold by capillary action. After evaporation and controlled heating to 600°C, the material solidifies into nanostructures for transistors and diodes. This process also leaves behind a graphene coating that improves conductivity and prevents oxidation.

But there is one “but”

While the method demonstrates impressive efficiency, it currently allows for wire widths of 44 nm to 1000 nm, which is not compatible with state-of-the-art chip manufacturing technologies such as TSMC's 2 nm process. Despite this limitation, the simplicity and speed of the new method make it suitable for many applications, including photonics and electronics.

Versatility and efficiency of the method

The fabricated elements are versatile, sensitive to both light and electric current, which opens up opportunities for advanced photonic and electronic applications. The process leads to a reduction in the number of defective elements and significantly accelerates the production rate compared to current semiconductor manufacturing methods.

How processors are made – watch the video:

This innovative approach has the potential to complement traditional chip manufacturing methods, offering a simplified and cost-effective alternative for certain use cases that could revolutionize the entire industry.