Scientists have created a new revolutionary technology that will significantly improve AI

The Broadcom company introduced its revolutionary 3.5D eXtreme Dimension System in Package (XDSiP) platform. It is designed to help AI companies develop advanced accelerators, or XPUs. This new technology combines 6000 mm² silicon and up to 12 stacks of high-bandwidth memory (HBM) in a single package. This optimizes efficiency and reduces power consumption for large AI applications.

The 3.5D XDSiP platform combines the advantages of 2.5D packaging and 3D technology, which creates new opportunities for the development of XPUs. Its innovative Face-to-Face (F2F) method connects the top metal layers of the chips. This reduces electrical interference and increases mechanical strength. It also leads to a seven-fold increase in signal density and a 10-fold decrease in energy consumption.

This technology has already attracted the attention of major players in the market, such as Fujitsu, and will become the basis for the development of new generations of artificial intelligence. Production of new products on the XDSiP platform will begin in February 2026, and it is expected to have a significant impact on the development of AI technologies.